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and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k;
Vergelijkbare producten zoals Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics 2004
This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the;
Vergelijkbare producten zoals Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics
. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range;
Vergelijkbare producten zoals Advanced Interconnects for ULSI Technology
advanced packaging; copper metallization; low-K dielectrics technology; modeling; reliability; barriers; atomic-layer epitaxy and other;
Vergelijkbare producten zoals Advanced Metallization Conference 2001 (AMC 2001)
technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical;
Vergelijkbare producten zoals Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009
technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical;
Vergelijkbare producten zoals Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009
(Cu) interconnects and dielectric materials with a low-dielectric constant (k) of about 3.0. However, for the next generations of 65nm node;
Vergelijkbare producten zoals Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics
Metallization discusses cluster equipment for IC manufacturing, copper advanced technology, gap filling, mechanical reliability, deposition technology;
Vergelijkbare producten zoals Advanced Materials for Interconnections
-k interdielectric materials are currently in high demand in the development of advanced ICs. One important approach to obtaining low-k;
Vergelijkbare producten zoals Low-K Nanoporous Interdielectrics
related to circuit interconnection; Part VIII contains papers on specific low-K dielectrics and their properties, and new methods for their;
Vergelijkbare producten zoals MRS Conference Proceedings Advanced Metallization Conference 2000 (AMC 2000)
semiconductor industry and the International Technology Roadmap for Semiconductors (ITRS). The application of high-k gate dielectric materials is a;
Vergelijkbare producten zoals High-k Gate Dielectric Materials
conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the;
Vergelijkbare producten zoals Copper Interconnect Technology
of silicon oxide by advanced low-k dielectrics demand further improvements of the diffusion barrier performance. It is the aim of this book to carry;
Vergelijkbare producten zoals Advanced Ta-Based Diffusion Barriers for Cu Interconnects
A state-of-the-art overview of high-k dielectric materials for advanced field-effect transistors, from both a fundamental and a;
Vergelijkbare producten zoals High-k Gate Dielectrics for CMOS Technology
, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder;
Vergelijkbare producten zoals Assembly and Reliability of Lead-Free Solder Joints
, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder;
Vergelijkbare producten zoals Assembly and Reliability of Lead Free Solder Joints
Advanced Dielectrics for Wireless Communications symposia. Topics include design of material, materials synthesis and processing, processing;
Vergelijkbare producten zoals Advances in Dielectric Materials and Electronic Devices
gates, and strained silicon to meet the demands of the International Technology Roadmap for Semiconductors as the technology generations were;
Vergelijkbare producten zoals Materials and Devices for End-Of-Roadmap and Beyond CMOS Scaling
gaps, use of emerging ultra low-k materials and their integration with CNT interconnects, and geometry-based crosstalk reduction techniques;
Vergelijkbare producten zoals Design and Crosstalk Analysis in Carbon Nanotube Interconnects
gaps, use of emerging ultra low-k materials and their integration with CNT interconnects, and geometry-based crosstalk reduction techniques;
Vergelijkbare producten zoals Design and Crosstalk Analysis in Carbon Nanotube Interconnects
in a variety of technology-oriented applications. The topics covered in this book include the investigations of materials having low dielectric;
Vergelijkbare producten zoals Dielectric Materials and Applications
This book describes up-to-date technology applied to high-K materials for More Than Moore applications, i.e. microsystems applied to;
Vergelijkbare producten zoals Ferroelectric Dielectrics Integrated on Silicon
Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst;
Vergelijkbare producten zoals Leadfree Solders
This book is a collection of papers from The American Ceramic Society's 35th International Conference on Advanced Ceramics and Composites;
Vergelijkbare producten zoals Advances in Solid Oxide Fuel Cells VII
. Environmental regulations are driving the worldwide adoption of lead-free soldering technology for electronics packaging, board assembly, and related;
Vergelijkbare producten zoals Lead-Free Solder Interconnect Reliability
addresses various issues for designing SRAM memory cells for advanced CMOS technology. To study LSI design, SRAM cell design is the best materials;
Vergelijkbare producten zoals Low Power and Reliable SRAM Memory Cell and Array Design
in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connectionsNew chapter on testing procedures, sample;
Vergelijkbare producten zoals Reliability and Failure of Electronic Materials and Devices
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