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Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics 2004

and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k;

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Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics

This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the;

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Advanced Interconnects for ULSI Technology

. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range;

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Advanced Metallization Conference 2001 (AMC 2001)

advanced packaging; copper metallization; low-K dielectrics technology; modeling; reliability; barriers; atomic-layer epitaxy and other;

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Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009

technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical;

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Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009

technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical;

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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics

(Cu) interconnects and dielectric materials with a low-dielectric constant (k) of about 3.0. However, for the next generations of 65nm node;

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Advanced Materials for Interconnections

Metallization discusses cluster equipment for IC manufacturing, copper advanced technology, gap filling, mechanical reliability, deposition technology;

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Low-K Nanoporous Interdielectrics

-k interdielectric materials are currently in high demand in the development of advanced ICs. One important approach to obtaining low-k;

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MRS Conference Proceedings Advanced Metallization Conference 2000 (AMC 2000)

related to circuit interconnection; Part VIII contains papers on specific low-K dielectrics and their properties, and new methods for their;

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High-k Gate Dielectric Materials

semiconductor industry and the International Technology Roadmap for Semiconductors (ITRS). The application of high-k gate dielectric materials is a;

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Copper Interconnect Technology

conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the;

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Advanced Ta-Based Diffusion Barriers for Cu Interconnects

of silicon oxide by advanced low-k dielectrics demand further improvements of the diffusion barrier performance. It is the aim of this book to carry;

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High-k Gate Dielectrics for CMOS Technology

A state-of-the-art overview of high-k dielectric materials for advanced field-effect transistors, from both a fundamental and a;

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Assembly and Reliability of Lead-Free Solder Joints

, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder;

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Assembly and Reliability of Lead Free Solder Joints

, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder;

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Advances in Dielectric Materials and Electronic Devices

Advanced Dielectrics for Wireless Communications symposia. Topics include design of material, materials synthesis and processing, processing;

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Materials and Devices for End-Of-Roadmap and Beyond CMOS Scaling

gates, and strained silicon to meet the demands of the International Technology Roadmap for Semiconductors as the technology generations were;

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Design and Crosstalk Analysis in Carbon Nanotube Interconnects

gaps, use of emerging ultra low-k materials and their integration with CNT interconnects, and geometry-based crosstalk reduction techniques;

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Design and Crosstalk Analysis in Carbon Nanotube Interconnects

gaps, use of emerging ultra low-k materials and their integration with CNT interconnects, and geometry-based crosstalk reduction techniques;

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Dielectric Materials and Applications

in a variety of technology-oriented applications. The topics covered in this book include the investigations of materials having low dielectric;

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Ferroelectric Dielectrics Integrated on Silicon

This book describes up-to-date technology applied to high-K materials for More Than Moore applications, i.e. microsystems applied to;

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Leadfree Solders

Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst;

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Advances in Solid Oxide Fuel Cells VII

This book is a collection of papers from The American Ceramic Society's 35th International Conference on Advanced Ceramics and Composites;

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Lead-Free Solder Interconnect Reliability

. Environmental regulations are driving the worldwide adoption of lead-free soldering technology for electronics packaging, board assembly, and related;

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Low Power and Reliable SRAM Memory Cell and Array Design

addresses various issues for designing SRAM memory cells for advanced CMOS technology. To study LSI design, SRAM cell design is the best materials;

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Reliability and Failure of Electronic Materials and Devices

in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connectionsNew chapter on testing procedures, sample;

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