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Advanced Interconnects for ULSI Technology

. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range;

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Electromigration In Ulsi Interconnections

is intended for both beginner and advanced readers on electromigration in ULSI interconnections. It begins with the basic knowledge required for a;

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Ulsi Semiconductor Technology Atlas

Semiconductor Technology Atlas uses examples and TEM (Transmission Electron Microscopy) micrographs to explain and illustrate ULSI process technologies;

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Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections

Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections provides a detailed description of the application;

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Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics 2004

and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k;

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Copper Interconnect Technology

interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic;

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ULSI Devices

these devices offer in power consumption, low-voltage and high-speed operation, and system-on-chip for ULSI applications. Supplemented with;

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Advanced Metallization Conference 2001 (AMC 2001)

advanced packaging; copper metallization; low-K dielectrics technology; modeling; reliability; barriers; atomic-layer epitaxy and other;

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Modeling and Characterization of Advanced Bipolar Transistors and Interconnects for Circuit Simulation

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Optical Interconnects for Data Centers

and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. Optical Interconnects for Data;

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Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009

technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical;

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Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009

technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical;

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Optical Interconnects for Future Data Center Networks

view of the future requirements of the data centers and serves as a reference work for some of the most advanced solutions that have been;

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Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics

This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the;

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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics

(Cu) interconnects and dielectric materials with a low-dielectric constant (k) of about 3.0. However, for the next generations of 65nm node;

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Advanced Materials for Interconnections

Metallization discusses cluster equipment for IC manufacturing, copper advanced technology, gap filling, mechanical reliability, deposition technology;

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Self-Organized 3D Integrated Optical Interconnects

computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE;

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New Approaches to Image Processing based Failure Analysis of Nano-Scale ULSI Devices

microscope image processing for metal and non-metallic microstructures. Engineers and scientists face the pressing problem in ULSI;

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Sub-Half-Micron Lithography for ULSIs

, for the trend of ever-increasing miniaturization to continue a breakthrough in lithography technology is now needed. This book describes;

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Photonic Interconnects for Computing Systems

provides a comprehensive overview of the current state-of-the-art technology and research achievements in employing silicon photonics for;

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Mega-Bit Memory Technology - From Mega-Bit to Giga-Bit

) process technologies-the longstanding technology driver of Si ULSI-as they advance from the 1 Kbit to the Gbit DRAM era.;

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Assembly and Reliability of Lead-Free Solder Joints

in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs;

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Assembly and Reliability of Lead Free Solder Joints

in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs;

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Carbon Nanotube and Graphene Nanoribbon Interconnects

An Alternative to Copper-Based Interconnect Technology With an increase in demand for more circuit components on a single chip, there;

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Carbon Nanotube and Graphene Nanoribbon Interconnects

An Alternative to Copper-Based Interconnect Technology With an increase in demand for more circuit components on a single chip, there;

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High-Speed Photonics Interconnects

of applications enabled by photonics interconnects technology. Learn about Optical Interconnect Technologies Suitable for High-Density Integration with;

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Mega-Bit Memory Technology - From Mega-Bit to Giga-Bit: From Mega-Bit to Giga-Bit

) process technologies-the longstanding technology driver of Si ULSI-as they advance from the 1 Kbit to the Gbit DRAM era.;

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