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Copper Interconnect Technology

mathematical modeling approaches to address the challenges of Cu-interconnect technology.;

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Advanced Materials for Interconnections

Metallization discusses cluster equipment for IC manufacturing, copper advanced technology, gap filling, mechanical reliability, deposition technology;

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Advanced Interconnects for ULSI Technology

Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k;

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Advanced Metallization Conference 2001 (AMC 2001)

advanced packaging; copper metallization; low-K dielectrics technology; modeling; reliability; barriers; atomic-layer epitaxy and other;

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MRS Conference Proceedings Advanced Metallization Conference 2000 (AMC 2000)

This book focuses on recent work in on-chip interconnects and other aspects of advanced metallization. In particular, the concentration for;

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Carbon Nanotube and Graphene Nanoribbon Interconnects

An Alternative to Copper-Based Interconnect Technology With an increase in demand for more circuit components on a single chip, there;

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Carbon Nanotube and Graphene Nanoribbon Interconnects

An Alternative to Copper-Based Interconnect Technology With an increase in demand for more circuit components on a single chip, there;

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Harsh Environment Electronics

book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It;

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Electromigration Modeling at Circuit Layout Level

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly;

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High Performance Integrated Circuit Design

role of on-chip interconnects and provides an overview of technology scaling. The book goes on to cover data signaling, power management;

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Inorganic Ternary Thin films

Thin films can be used to fabricate optoelectronic devices. Technology is currently focusing on ternary thin film composition because;

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Development of Sub-mm Wave Flip-Chip Interconnect

Development of Sub-mm Wave Flip-Chip Interconnect;

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Dawn of the Metal Age

The fifth millennium BCE was a period of rapid social change. One of the key factors was the developments in technology which led to the;

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Dawn of the Metal Age

The fifth millennium BCE was a period of rapid social change. One of the key factors was the developments in technology which led to the;

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Deportment of Copper, Silver, Bismuth and Selenium During Solvent Extraction of Gold

Solvent extraction technology is a technology that is used comercially for gold recovery and purification from copper electrorefining anode;

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Advanced Ta-Based Diffusion Barriers for Cu Interconnects

During the last few years, copper has become the standard metallisation material for on-chip interconnects in high-performance;

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Interconnect Analysis And Synthesis

State-of-the-art methods and current perspectives on interconnect The irrepressible march toward smaller and faster integrated circuits has;

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Optimal Interconnect Networks for 2D and 3D Microchips

We are today in the era of gigascale 2D and 3D integrated circuits. These microchips are typically considered to be "interconnect limited;

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The Legacy of American Copper Smelting

Throughout world history, copper has been a significant metal for a vast number of cultures, from the oldest civilisations on record to the;

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3D Interconnect Architectures for Heterogeneous Technologies

This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs;

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Extractive Metallurgy of Copper

coverage of the copper production process, encompassing topics as diverse as environmental technology for wind and solar energy transmission;

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Three-Dimensional Molded Interconnect Devices (3D-MID)

Three-dimensional molded interconnect devices (MIDs) enable mechanical, electronic, optical, thermal and fluidic functions to be integrated;

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Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections

of finite element methods (FEMs) to the study of ULSI interconnect reliability. Over the past two decades the application of FEMs has become;

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Copper and Bacteria

In the past two decades, great progress has been made in the understanding of copper as a bioelement. The book summarizes the current;

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Copper Nanostructures: Next-Generation of Agrochemicals for Sustainable Agroecosystems

Copper Nanostructures: Next-Generation of Agrochemicals for Sustainable Agroecosystems considers the impact of copper-based;

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Native copper objects of the Copper Eskimo

Native copper objects of the Copper Eskimo This book, "Native copper objects of the Copper Eskimo," by Donald A. Cadzow, is a replication;

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Copper Alloys

Copper has been used for various purposes through the ages. It is utilized excessively in handicrafts and other industries due to its easy;

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