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3D Interconnect Architectures for Heterogeneous Technologies

heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture;

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Optimal Interconnect Networks for 2D and 3D Microchips

We are today in the era of gigascale 2D and 3D integrated circuits. These microchips are typically considered to be "interconnect limited;

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Emerging Devices for Low-Power and High-Performance Nanosystems

either by hybrid and heterogeneous CMOS in 2D3D or by emerging devices for alternative sensing, actuating, data storage, and processing. The;

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Die-stacking Architecture

solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip;

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Enabling Technologies and Architectures for Next-Generation Networking Capabilities

networks can now be utilized to extend the growing era of the Internet of Things. Enabling Technologies and Architectures for Next-Generation;

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Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009

technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical;

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Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009

technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical;

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Electromigration Modeling at Circuit Layout Level

of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own;

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3D Integration in VLSI Circuits: Implementation Technologies and Applications

element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the;

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Multi-Processor System-on-Chip 1 - Architectures

components and technologies to build efficient MPSoC architectures. All the main components are detailed: use of memory and their technology;

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Remote Sensed Data and Processing Methodologies for 3D Virtual Reconstruction and Visualization of Complex Architectures

Remote Sensed Data and Processing Methodologies for 3D Virtual Reconstruction and Visualization of Complex Architectures is een boek;

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3D and Circuit Integration of MEMS

3D and Circuit Integration of MEMS Explore heterogeneous circuit integration and the packaging needed for practical applications;

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3D Integration in VLSI Circuits

element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the;

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High-Performance Computing on Complex Environments

heterogeneous and hierarchical architectures and distributed systems, detailed studies on the impact of applying heterogeneous computing practices to;

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Three-Dimensional Molded Interconnect Devices (3D-MID)

Three-dimensional molded interconnect devices (MIDs) enable mechanical, electronic, optical, thermal and fluidic functions to be integrated;

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Multimaterial 3D Printing Technology

3D printing. Introduces the heterogeneous object model for 3D printing Provides case studies of the use of hybrid 3D;

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LTE Self-Organising Networks (SON)

, requirements, challenges, enabling technologies and architectures for a SON-enabled system * Covers multi-technology (2G/3G) aspects as well as core;

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Design of Cost-Efficient Interconnect Processing Units

technology that is set to replace well-known shared bus architectures, such as STBus, for demanding multiprocessor system-on-chip (SoC) applications;

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Heterogeneous Reconfigurable Processors for Real Time Baseband Processing

This book focuses on domain-specific heterogeneous reconfigurable architectures, demonstrating for readers a computing platform which;

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Heterogeneous Computing Architectures

Heterogeneous Computing Architectures: Challenges and Vision provides an updated vision of the state-of-the-art of heterogeneous computing;

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Energy-Efficient VLSI Architectures for Real-Time and 3D Video Processing

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Accelerator Programming Using Directives

three sections: porting scientific applications to heterogeneous architectures using directives; directive-based programming for math libraries;

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Media Networks

protocols and standards. It examines the different digital TV technologies as well as their deployment architectures. Illustrating the role;

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Media Networks

protocols and standards. It examines the different digital TV technologies as well as their deployment architectures. Illustrating the role;

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Heterogeneous Memory Organizations in Embedded Systems

problem of placement for dynamic data objects on embedded systems with heterogeneous memory architectures, presenting a complete methodology that;

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Heterogeneous Memory Organizations in Embedded Systems

problem of placement for dynamic data objects on embedded systems with heterogeneous memory architectures, presenting a complete methodology that;

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Design and Crosstalk Analysis in Carbon Nanotube Interconnects

. This book will be useful for researchers and design engineers working on carbon nanotubes for interconnects for both 2D and 3D integrated;

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