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the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects;
Vergelijkbare producten zoals Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009
the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects;
Vergelijkbare producten zoals Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009
semiconductor. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and;
Vergelijkbare producten zoals Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics
, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster;
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in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs;
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in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs;
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. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range;
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Metallization discusses cluster equipment for IC manufacturing, copper advanced technology, gap filling, mechanical reliability, deposition technology;
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in organic nanostructures for transistors and memories Synthesis of molecular bioelectronic nanostructures Nanostructured electrode materials for;
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advanced packaging; copper metallization; low-K dielectrics technology; modeling; reliability; barriers; atomic-layer epitaxy and other;
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This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the;
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Micro- and Nanoelectronics: Emerging Device Challenges and Solutions presents a comprehensive overview of the current state of the art;
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The Nano Science and Technology Institute (NSTI) have built a tradition of being the most prestigious forum in the world for leading Nano;
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Joining Processes for Dissimilar and Advanced Materials describes how to overcome the many challenges involved in the joining;
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encounter. * Models and simulates numerous processes in manufacturing, reliability and testing for the first time * Provides the skills necessary;
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integrated circuit sections of this book. This book provides valuable resource materials for scientists and electrical engineers who want to learn;
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their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals;
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Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst;
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This edition of 'Reliability of MEMS' was originally published in the successful series 'Advanced Micro & Nanosystems'. Here, one of the;
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in nanoelectronics research and development. The book also showcases some key application areas of micro-electro-mechanical-systems (MEMS) that have reached;
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Micro-nanoelectronics Devices: Modeling of Diffusion and Operation Processes concentrates on the modeling of diffusion processes and;
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understanding of fundamentals on a wide range of state-of-the-art materials manufacturing processes for upper undergraduates, graduate students, and;
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, aircraft, automotive, defence and aerospace, as well other advanced industries. This book reviews research developments in micro and;
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, aircraft, automotive, defence and aerospace, as well other advanced industries. This book reviews research developments in micro and;
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various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro;
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processes and their application in advanced machining, micromachining, and finishing operations. The fundamentals section of the book discusses the;
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CNT applications such as terahertz, sensors, interconnects, and capacitors Nano system architectures for reliability Nanowire device;
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