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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics

semiconductor. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and;

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Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009

the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects;

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Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009

the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects;

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Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics 2004

, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster;

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Assembly and Reliability of Lead-Free Solder Joints

in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs;

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Assembly and Reliability of Lead Free Solder Joints

in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs;

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Advanced Interconnects for ULSI Technology

. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range;

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Advanced Metallization Conference 2001 (AMC 2001)

advanced packaging; copper metallization; low-K dielectrics technology; modeling; reliability; barriers; atomic-layer epitaxy and other;

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Advanced Materials for Interconnections

Metallization discusses cluster equipment for IC manufacturing, copper advanced technology, gap filling, mechanical reliability, deposition technology;

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Nanoelectronics

in determining the overall IC performance. The importance of integration of optics with electronics is elucidated in the optoelectronics and photonic;

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Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics

This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the;

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Nanoelectronics

in organic nanostructures for transistors and memories Synthesis of molecular bioelectronic nanostructures Nanostructured electrode materials for;

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Micro- and Nanoelectronics

Micro- and Nanoelectronics: Emerging Device Challenges and Solutions presents a comprehensive overview of the current state of the art;

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Advanced Manufacturing, Electronics and Microsystems: Techconnect Briefs 2015

The Nano Science and Technology Institute (NSTI) have built a tradition of being the most prestigious forum in the world for leading Nano;

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Micro & Nanomanufacturing Research

, aircraft, automotive, defence and aerospace, as well other advanced industries. This book reviews research developments in micro and;

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Micro & Nanomanufacturing Research

, aircraft, automotive, defence and aerospace, as well other advanced industries. This book reviews research developments in micro and;

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Joining Processes for Dissimilar and Advanced Materials

Joining Processes for Dissimilar and Advanced Materials describes how to overcome the many challenges involved in the joining;

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Advanced Nanoelectronics

terahertz electronics are reviewed as essential add-on electronics for enhanced communication and computational capabilities. Advanced;

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Optical Interconnects

management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will;

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Optical Interconnects

management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will;

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Micro-nanoelectronics Devices

Micro-nanoelectronics Devices: Modeling of Diffusion and Operation Processes concentrates on the modeling of diffusion processes and;

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MRS Conference Proceedings Advanced Metallization Conference 2000 (AMC 2000)

This book focuses on recent work in on-chip interconnects and other aspects of advanced metallization. In particular, the concentration for;

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Modeling and Simulation for Microelectronic Packaging Assembly

encounter. * Models and simulates numerous processes in manufacturing, reliability and testing for the first time * Provides the skills necessary;

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Design and Crosstalk Analysis in Carbon Nanotube Interconnects

gaps, use of emerging ultra low-k materials and their integration with CNT interconnects, and geometry-based crosstalk reduction techniques;

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Design and Crosstalk Analysis in Carbon Nanotube Interconnects

gaps, use of emerging ultra low-k materials and their integration with CNT interconnects, and geometry-based crosstalk reduction techniques;

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Microelectronics to Nanoelectronics

in nanoelectronics research and development. The book also showcases some key application areas of micro-electro-mechanical-systems (MEMS) that have reached;

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AntennainPackage Technology and Applications

A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and;

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