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Development of Sub-mm Wave Flip-Chip Interconnect

Development of Sub-mm Wave Flip-Chip Interconnect;

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Silicon-Germanium Heterojunction Bipolar Transistors for Mm-wave Systems Technology, Modeling and Circuit Applications

functionalities) and 30% of the price of a monitor in the early 2000's. Interest in utilizing the (sub-)mm-wave frequency spectrum for commercial and;

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Design of CMOS Millimeter-Wave and Terahertz Integrated Circuits with Metamaterials

Evaluates novel mm-wave and THz communication and imaging systems under CMOS-based system-on-chip integration Design of CMOS Millimeter-Wave and;

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On-Wafer Calibration Techniques Enabling Accurate Characterization of High-Performance Silicon Devices at the mm-Wave Range and Beyond

communication, automotive radar, imaging and sensing systems and many other mm-wave and THz applications. S-parameter measurement at mm-wave and sub-mm;

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Aperture Antennas for Millimeter and Sub-Millimeter Wave Applications

ESF research networking program 'Newfocus' and co-authored by the most active and highly cited research groups in the domain of mm- and sub-mm;

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The Cambridge RF and Microwave Engineering Series

Build high-performance, spectrally clean, energy-efficient mm-wave power amplifiers and transmitters with this cutting-edge guide to;

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Design of Cost-Efficient Interconnect Processing Units

Streamlined Design Solutions Specifically for NoC To solve critical network-on-chip (NoC) architecture and design problems related to;

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Millimeter-Wave Digitally Intensive Frequency Generation in CMOS

modeling, critical building block design, and digital calibration techniques, making it highly suitable for those who want to learn about mm-wave;

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Microelectronic Packaging

development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies;

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Interconnect Analysis And Synthesis

reduction and moment matching to transmission-line analysis An overview of the effects of inductance on on-chip interconnect Flexible CAD algorithms;

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Microelectronic Interconnections and Assembly

-scale, chip-flip, and direct chip attachments are described. Although wire bonding currently dominates the market, the consensus is that flip;

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High-Speed and Lower Power Technologies

optical interconnect, low-power network-on-chip (NoC) router, X-ray quantum counting, and a design of low-power power amplifiers. Covers;

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High-Speed and Lower Power Technologies

optical interconnect, low-power network-on-chip (NoC) router, X-ray quantum counting, and a design of low-power power amplifiers;

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Batteryless mm-Wave Wireless Sensors

system in which the wireless sensors consist of wireless power receiving, sensing and communication functions in a single chip, without external;

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Force Sensors for Microelectronic Packaging Applications

Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical;

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Reconfigurable Circuits and Technologies for Smart Millimeter-Wave Systems

Get up to speed on the modelling, design, technologies, and applications of tunable circuits and reconfigurable mm-wave systems. Coverage;

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Self-Organized 3D Integrated Optical Interconnects

modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules;

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Three-dimensional Integrated Circuit Design

), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip;

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High Performance Integrated Circuit Design

role of on-chip interconnects and provides an overview of technology scaling. The book goes on to cover data signaling, power management;

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RF and mm-Wave Power Generation in Silicon

RF and mm-Wave Power Generation in Silicon presents the challenges and solutions of designing power amplifiers at RF and mm-Wave;

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Quality Conformance and Qualification of Microelectronic Packages and Interconnects

single--and multi--chip modules is examined, including chip and wire--bonds, tape--automated (TAB), flip--TAB, flip--chip bonds, high--density;

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Synthesized Transmission Lines

lines, which represent fundamental elements in microwave and mm-wave integrated circuits, including on-chip integration Covers topics that are;

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Wire Aware Cache Architecture

leverages varying latency and bandwidth needs of on-chip global messages to alleviate interconnect overhead.;

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2-mm Wave Band EPR Spectroscopy of Condensed Systems

This is the first book to summarize the problems of using modern high-resolution 2-mm wave band EPR spectroscopy in an interdisciplinary;

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Cellular Nanoscale Sensory Wave Computing

companionefforts is the concept of cellular nonlinear/neuralnetwork (CNN) technology and its various extensions and chip implementations, including;

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mm-Wave Silicon Technology

This book compiles and presents the research results from the past five years in mm-wave Silicon circuits. This area has received a great;

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Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009

Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm;

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