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Advanced Ta-Based Diffusion Barriers for Cu Interconnects

are needed to prevent Cu diffusion into the insulating layers surrounding the metallic interconnects. Since Ta-based compounds are;

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Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics 2004

materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel;

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MRS Conference Proceedings Advanced Metallization Conference 2000 (AMC 2000)

This book focuses on recent work in on-chip interconnects and other aspects of advanced metallization. In particular, the concentration for;

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Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics

This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the;

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Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009

technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical;

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Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009

technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical;

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Advanced Interconnects for ULSI Technology

. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range;

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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics

(Cu) interconnects and dielectric materials with a low-dielectric constant (k) of about 3.0. However, for the next generations of 65nm node;

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Advances in Materials Science Research

, properties and thermal stability of quasi-amorphous Ta-Si-N diffusion barriers; sol-gel immobilised micro-organisms for bioremediation systems and;

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Advanced Metallization Conference 2001 (AMC 2001)

Leading-edge advanced metallization schemes, as applied to VLSI interconnects, include the introduction of novel metals systems and novel;

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Electromigration In Ulsi Interconnections

is intended for both beginner and advanced readers on electromigration in ULSI interconnections. It begins with the basic knowledge required for a;

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Advanced Materials for Interconnections

The conference "Advanced Materials for Interconnections" took place in Strasbourg on 4-7 June 1996 hosted by the EMRS Society. Based on the;

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Nucleation and Growth of Metals

extensively described, providing state-of-the art information on Cu electroplating and related processes for the fabrication of advanced interconnects;

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Copper Interconnect Technology

conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the;

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Design and Crosstalk Analysis in Carbon Nanotube Interconnects

This book provides a single-source reference on carbon nanotubes for interconnect applications. It presents the recent advances;

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Design and Crosstalk Analysis in Carbon Nanotube Interconnects

This book provides a single-source reference on carbon nanotubes for interconnect applications. It presents the recent advances;

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Hc Pht ung Phap

Sau khi chung ta Äoc qua ban kinh nay moi hieu rang viec hoc Phat cua nguoi cu si tai gia von khong co gi tro ngai, cung khong co gi la;

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Modeling and Characterization of Advanced Bipolar Transistors and Interconnects for Circuit Simulation

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Optical Interconnects for Future Data Center Networks

view of the future requirements of the data centers and serves as a reference work for some of the most advanced solutions that have been;

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Self-Organized 3D Integrated Optical Interconnects

computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE;

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Carbon Nanotube and Graphene Nanoribbon Interconnects

An Alternative to Copper-Based Interconnect Technology With an increase in demand for more circuit components on a single chip, there;

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Carbon Nanotube and Graphene Nanoribbon Interconnects

An Alternative to Copper-Based Interconnect Technology With an increase in demand for more circuit components on a single chip, there;

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Optical Interconnects for Data Centers

Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to;

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Assembly and Reliability of Lead-Free Solder Joints

in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs;

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Assembly and Reliability of Lead Free Solder Joints

in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs;

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A Review of the Alumina/Ag-Cu-Ti Active Metal Brazing Process

Prize (sponsored by Morgan Advanced Materials plc) for Best Ceramics PhD Thesis in the UK. It focusses on the alumina/Ag-Cu-Ti system to cover;

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A Review of the Alumina/Ag-Cu-Ti Active Metal Brazing Process

Prize (sponsored by Morgan Advanced Materials plc) for Best Ceramics PhD Thesis in the UK. It focusses on the alumina/Ag-Cu-Ti system to cover;

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