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Lead-Free Solder Interconnect Reliability

This book provides the most up-to-date knowledge and data available on the reliability of lead-free solder interconnects. The content has;

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Lead Free Solder

on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides;

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Assembly and Reliability of Lead-Free Solder Joints

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed;

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Assembly and Reliability of Lead Free Solder Joints

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed;

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Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for;

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Study of SnAgCu Alloy Reliability

This work aims to understand the reliability of SnAgCu solder interconnects used in PBGA packages using microstructure evolution, laser;

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Electronics Manufacturing

printing methods * Lead-free solder joint reliability of WLCSPs on organic and ceramic substrates * Chip (wafer) level interconnects with;

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Investigations on Microstructure and Mechanical Properties of the Cu Pb free Sol

-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation;

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Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections

of finite element methods (FEMs) to the study of ULSI interconnect reliability. Over the past two decades the application of FEMs has become;

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Lead-Free Electronics

Based on the results of a more than two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing is the first;

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Solder Joint Reliability Assessment

This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation;

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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

of solder joint reliability and present creative, robust packaging techniques for cost-effective interconnection.;

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Reliability and Failure of Electronic Materials and Devices

in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connectionsNew chapter on testing procedures, sample;

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Lead-free Soldering Process Development and Reliability

Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive;

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Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science

-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic;

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Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009

the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects;

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Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009

the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects;

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Intermetallic Study Between Sn-AG-Cu-Zn Solders and Copper Substrate

legislation to ban toxic materials in solder and demands for "green products," a variety of lead-free solders have been developed. Sn-Ag-Cu solder;

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Solder Materials

, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not;

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Leadfree Solders

too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop;

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Electromigration Modeling at Circuit Layout Level

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly;

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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Describes how to use the;

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Reliability and Failure of Electronic Materials and Devices

Suitable as a reference work for reliability professionals or as a text for advanced undergraduate or graduate students, this book;

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Lead-Free Solder Process Development

theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced;

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Electrically Conductive Adhesives

excellent alternative to lead-solder interconnects for microelectronic packaging applications. ECAs are used in electronics for laptop computers;

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Harsh Environment Electronics

book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It;

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Interconnect Analysis And Synthesis

performance and reliability have all been thoroughly investigated in recent years. Interconnect Analysis and Synthesis provides CAD researchers and;

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