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Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global;
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This book provides the most up-to-date knowledge and data available on the reliability of lead-free solder interconnects. The content has;
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This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for;
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This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed;
Vergelijkbare producten zoals Assembly and Reliability of Lead-Free Solder Joints
This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed;
Vergelijkbare producten zoals Assembly and Reliability of Lead Free Solder Joints
Based on the results of a more than two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing is the first;
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factors and for two different lead-free solder alloys. A new technique using laser moire interferometry was developed to assess the deformation;
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explored: * Chip (wafer) level interconnects with lead-free solder bumps * Lead-free solder wafer bumping with micro-ball mounting and paste;
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-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic;
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legislation to ban toxic materials in solder and demands for "green products," a variety of lead-free solders have been developed. Sn-Ag-Cu solder;
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-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation;
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in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connectionsNew chapter on testing procedures, sample;
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board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint;
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This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation;
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This new volume by interconnection expert on solder joints, Johns H. Lau, deals with BGA, CSP, Flip Chips, and other new technologies that;
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at;
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Publisher: Providence, R.I., The M. W. Dunton company Publication date: 1919 Subjects: Solder and soldering. [from old catalog] Notes: This;
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This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction;
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Lead-free Electronics provides guidance on the design and use of lead-free electronics as well as technical and legislative perspectives;
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Provides in-depth knowledge on lead-free piezoelectrics - for state-of-the-art, environmentally friendly electrical and electronic devices;
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Learn the fundamentals of soldering - and pick up an essential skill for building electronic gadgets. You'll discover how to preheat and;
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, is presented. The authors deal with the issue of lead-free solders at high application temperatures, with the aim to study the effect of lanthanides;
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piezoelectric ceramics industry, there is no issue of more importance than the transition to lead-free materials. The goal of Lead-Free Piezoelectrics;
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Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive;
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excellent alternative to lead-solder interconnects for microelectronic packaging applications. ECAs are used in electronics for laptop computers;
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