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Solder Paste in Electronics Packaging

soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those;

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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

This new volume by interconnection expert on solder joints, Johns H. Lau, deals with BGA, CSP, Flip Chips, and other new technologies that;

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Assembly and Reliability of Lead-Free Solder Joints

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed;

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Assembly and Reliability of Lead Free Solder Joints

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed;

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Lead Free Solder

Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global;

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Electronics Manufacturing

explored: * Chip (wafer) level interconnects with lead-free solder bumps * Lead-free solder wafer bumping with micro-ball mounting and paste;

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Lead-Free Solder Interconnect Reliability

This book provides the most up-to-date knowledge and data available on the reliability of lead-free solder interconnects. The content has;

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Electronic Packaging Science and Technology

fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding;

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Reliability and Failure of Electronic Materials and Devices

discharge, corrosion, and failure of contacts and solder jointsNew updated sections on "failure physics," on mass transport-induced failure;

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Mems Packaging

, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and;

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Electrically Conductive Adhesives

excellent alternative to lead-solder interconnects for microelectronic packaging applications. ECAs are used in electronics for laptop computers;

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The Handbook Of Machine Soldering

A shop-floor guide to the machine soldering of electronics Sound electrical connections are the operational backbone of every piece;

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RF and Microwave Microelectronics Packaging II

This book presents the latest developments in packaging for high-frequency electronics. It is a comp;...

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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at;

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Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009

for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges;

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Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009

for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges;

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Lead-Free Electronics

practical, primary reference to cover Pb-free solder assembly as well as the analysis and reasoning behind the selection of Sn-Ag-Cu as the;

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Nano-Bio- Electronic, Photonic and MEMS Packaging

This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging ;...

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Soldering in Electronics Assembly

of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical;

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Electronics Packaging Forum

This is the first volume of an annual monographic series devoted to the diverse aspects of electroni;...

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Electronic Games for the Evil Genius

the fundamentals of electronics and circuitry, how to read schematics, solder, use tools, and construct circuits - while you have fun putting;

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Practical Guide to the Packaging of Electronics

Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems A def;...

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Practical Guide to the Packaging of Electronics

Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems A definit;...

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Portable Consumer Electronics

Portable consumer electronic devices have experienced exponential growth in recent years. Although t;...

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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overvi;...

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Handbook Of Electronics Packaging Design and Engineering

The Handbook of Electronics Packaging Design and Engineering has been writ- ten as a reference sourc;...

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Practical Guide to the Packaging of Electronics

As the demand for packaging more electronic capabilities into smaller packages rises, product develo;...

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