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Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and;
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Identifies reliability issues and concerns Develops the ability to conduct a more thorough analysis for the final design Includes;
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concerns Develops the ability to conduct a more thorough analysis for the final design Includes design tips and guidelines for each aspect;
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packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique;
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packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique;
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The Handbook of Electronics Packaging Design and Engineering has been writ- ten as a reference source for use in the packaging design;
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, design, and reliability aspects of these products until the publication of this new book. Written by two noted leaders of the electronics;
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the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.;
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Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various;
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Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment;
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Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material;
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for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation;
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for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation;
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design in wind turbine and photovoltaic systems; reliability of power conversion systems in photovoltaic applications; power supplies for;
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-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging;
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& beams; Analysis of beams, frames & vibration records; Theoretical solutions for foundation vibration problems; Design of shallow & deep;
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face for design engineers, researchers, postgraduates, postdoctoral researchers, university professors, and consultants.;
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practices for the design of these electronics. Continuing beyond just the paper design of building blocks, the book rounds out coverage of the;
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in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure;
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DESIGN FOR EXCELLENCE IN ELECTRONICS MANUFACTURING An authoritative guide to optimizing design for manufacturability and reliability from a;
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Power Electronics Basics: Operating Principles, Design, Formulas, and Applications provides fundamental knowledge for the analysis and;
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Power Electronics Basics: Operating Principles, Design, Formulas, and Applications provides fundamental knowledge for the analysis and;
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This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to;
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enabling techniques such as advanced fatigue life modeling, crack propagation analysis, and probabilistic robust design of lead-free electronics;
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enabling techniques such as advanced fatigue life modeling, crack propagation analysis, and probabilistic robust design of lead-free electronics;
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, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices;
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This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to RF and Microwave;
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