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Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since;

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Wafer-Level Chip-Scale Packaging

IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process;

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Power Electronic Packaging

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since;

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Modeling and Simulation for Microelectronic Packaging Assembly

engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability;

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Reliability of Power Electronic Converter Systems

introduction to reliability engineering in power electronic converter systems; anomaly detection and remaining-life prediction for power electronics;

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Portable Consumer Electronics

, design, and reliability aspects of these products until the publication of this new book. Written by two noted leaders of the electronics;

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Assembly and Reliability of Lead-Free Solder Joints

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed;

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Assembly and Reliability of Lead Free Solder Joints

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed;

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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and;

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Electronic Packaging Science and Technology

, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices;

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Essentials of Electronic Packaging

This book provides the basic essentials and fundamentals of electronic packaging technology. It introduces the language and terminology;

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Electronic Packaging Materials and Their Properties

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost;

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Handbook of Electronic Package Design

begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues;

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3D IC Integration and Packaging

complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail. 3D;

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Design for Excellence in Electronics Manufacturing

DESIGN FOR EXCELLENCE IN ELECTRONICS MANUFACTURING An authoritative guide to optimizing design for manufacturability and reliability from a;

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Quality Conformance and Qualification of Microelectronic Packages and Interconnects

of products containing electronic components, here is a comprehensive handbook to the theory and methods surrounding the assembly of microelectronic;

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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic;

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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic;

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Lead Free Solder

Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global;

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Practical Guide to the Packaging of Electronics

the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third;

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Practical Guide to the Packaging of Electronics

field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third;

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Advanced Thermal Design of Electronic Equipment

) has spiraled. Much of the improvement in the reliability and packaging density of electronic circuits can be traced to advances in thermal;

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Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines

design--for--reliability guidelines and approaches essential for achieving their life--cycle, cost--effectiveness, and on--time delivery goals;

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MEMS Reliability

yield, design for reliability (DFR), packaging and testing.;

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Reliability and Failure of Electronic Materials and Devices

Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single;

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Aircraft

In early stages of an aircraft design process, it is necessary to determine the minimum thrust or power requirement and rapidly select the;

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Power Systems and Smart Energies

Power Systems & Smart Energies (PSE) is dedicated to the design, modeling, exploitation and diagnostics of electrical power systems and;

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