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Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since;
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IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process;
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Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since;
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engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability;
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introduction to reliability engineering in power electronic converter systems; anomaly detection and remaining-life prediction for power electronics;
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, design, and reliability aspects of these products until the publication of this new book. Written by two noted leaders of the electronics;
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This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed;
Vergelijkbare producten zoals Assembly and Reliability of Lead-Free Solder Joints
This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed;
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Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and;
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, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices;
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This book provides the basic essentials and fundamentals of electronic packaging technology. It introduces the language and terminology;
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Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost;
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begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues;
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complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail. 3D;
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DESIGN FOR EXCELLENCE IN ELECTRONICS MANUFACTURING An authoritative guide to optimizing design for manufacturability and reliability from a;
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of products containing electronic components, here is a comprehensive handbook to the theory and methods surrounding the assembly of microelectronic;
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modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic;
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modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic;
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Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global;
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the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third;
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field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third;
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) has spiraled. Much of the improvement in the reliability and packaging density of electronic circuits can be traced to advances in thermal;
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design--for--reliability guidelines and approaches essential for achieving their life--cycle, cost--effectiveness, and on--time delivery goals;
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yield, design for reliability (DFR), packaging and testing.;
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Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single;
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Power Systems & Smart Energies (PSE) is dedicated to the design, modeling, exploitation and diagnostics of electrical power systems and;
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