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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic;
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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic;
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in high-speed printed circuit boards, especially for boards in high data-rate systems. The authors describe the classic applications;
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detailed mathematical derivations Circuit Oriented Electromagnetic Modeling Using the PEEC Techniques is a reference for students, researchers, and;
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with applications in electromagnetic compatibility and high-speed digital design. The topics-ranging from Maxwell's theory and multi;
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with applications in electromagnetic compatibility and high-speed digital design. The topics-ranging from Maxwell's theory and multi-conductor;
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. Introduction to Electromagnetic Compatibility provides thorough coverage of the techniques and methodologies used to design and analyze electronic;
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"Mark I. Montrose, the best-selling author of PRINTED CIRCUIT BOARD DESIGN TECHNIQUES FOR EMC COMPLIANCE, now brings you his newest book;
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offers a unique source of key reference data, practical guidance, and circuit and package design basics. Through three best-selling editions;
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Electromagnetic Modeling for High Speed Electronics systematically reviews a series of fast and efficient electromagnetic modeling techniques. The book;
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they need to lay out digital circuit boards for fast logic and to get designs working the first time around. Presenting an alternative to the;
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design techniques for advanced optical transmitter and receiver front-end circuits. The book includes an overview of optical communication;
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megahertz range qualify for high-speed. Proper design results in quality digital transmissions and lowers the chance for errors. This book is for;
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This book describes for readers the entire, interconnected complex of theoretical and practical aspects of designing and organizing the;
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rigid printed wiring boards. While there are many useful books and articles on the fabrication of printed circuit boards, Materials for Rigid;
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Revised, updated, and expanded, Electromagnetic Compatibility: Methods, Analysis, Circuits, and Measurement, Third Edition provides;
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book fills the gap between the high-level academic knowledge in the electromagnetic compatibility (EMC) field and the recommended practical;
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layout is based on real-life experience, training, and knowledge. Printed Circuit Board Techniques for EMC Compliance, Second Edition will help;
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on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides;
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real-world design examples. Provides knowledge and guidance in the design of high speed digital circuitsExplores the;
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Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost;
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, and high speed designs using boards with only two layers * Demonstrates how circuit geometry controls performance from dc to gigahertz;
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tools for FPGA design and electronic circuit design, you'll learn how to design, build, test, and debug high-performance FPGA-based IoT devices;
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of printed circuit board (PCB) design and fabrication The printed circuit is the basic building block of the electronics hardware industry. This;
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issues, low noise amplifiers, power amplifiers for handset applications and high power, power amplifiers. Additional chapters cover other circuit;
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, Application for power amplifier design and Electromagnetic Compatibility of Integrated Circuits, reflecting basic theories in the areas. What's more;
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for senior undergraduates, postgraduates, lecturers and laboratory researchers engaged in electric vehicle and electromagnetic compatibility;
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