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face for design engineers, researchers, postgraduates, postdoctoral researchers, university professors, and consultants.;
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3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D;
Vergelijkbare producten zoals Advances In 3d Integrated Circuits And Systems
3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D;
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Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative;
Vergelijkbare producten zoals Design of 3D Integrated Circuits and Systems
Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative;
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IC Integration and Packaging covers: * 3D integration for semiconductor IC packaging * Through-silicon vias modeling and testing;
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Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and;
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. Covers Assertion Based Design, Verification & Debug; Includes language-based modeling and design techniques for embedded systems; Covers design;
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Assertion Based Design, Verification & Debug; Includes language-based modeling and design techniques for embedded systems; Covers design, modeling;
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solutions for system modeling and design.;
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Design and Construction explores the efficient way to convert 2D construction plans into a 3D model that can be used for planning, clash;
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. Chapter 4 discusses the two common RRAM array architectures for large-scale integration: one-transistor-one-resistor (1T1R) and cross-point;
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. Chapter 4 discusses the two common RRAM array architectures for large-scale integration: one-transistor-one-resistor (1T1R) and cross-point;
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system. Scientists, research engineers, and postgraduate students interested in electromagnetism, microwave theory, electrical engineering, or;
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The book discusses the concept of process automation and mechatronic system design, while offering a unified approach and methodology for;
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The book discusses the concept of process automation and mechatronic system design, while offering a unified approach and methodology for;
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RF and Microwave Module Level Design and Integration presents a thorough introduction to the basic elements of radio frequency (RF) and;
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This guide is for all VLSI system designers, senior undergraduate or graduate students of microelectronics design, and companies offering;
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-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal;
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-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal;
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from both academia and the software industry to present theories of multiphysics simulation by design for electrical machines, power;
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comprehensive tutorials for every aspect of modeling and texturing 3D characters. Learn how, why, and when to use the most efficient techniques so you;
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3D and Circuit Integration of MEMS Explore heterogeneous circuit integration and the packaging needed for practical applications;
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essential for power system design, commissioning, operation and maintenance. This book focuses on the modeling and simulation;
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for sleeve valve, modeling and simulation of high performance electrical vehicle powertrains in VHDL-AMS, analysis, modeling and simulation;
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Design and Implementation of 3D Graphics Systems covers the computational aspects of geometric modeling and rendering 3D scenes. Special;
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Design and Implementation of 3D Graphics Systems covers the computational aspects of geometric modeling and rendering 3D scenes. Special;
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