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Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various;
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materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser;
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This brief provides a comprehensive review of lignocellulosic materials and their primary role in the future development of bio-based;
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Materials for High-Density Electronic Packaging and Interconnection is een boek van National Research Council;
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supercapacitors and their packaging. Nano- Bio- Electronic, Photonic and MEMS Packaging is the ideal book for all biomedical engineers, industrial;
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The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance;
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modification and other techniques. It describes the main practical properties and applications of polymer materials and highlights the analysis of all;
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new materials and technologies to increasingly prevalent lead-free manufacturing practices, Electronic Packaging and Interconnection Handbook;
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in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes;
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nanocomposites, and renewable and biodegradable materials. It details physical, thermal, and barrier properties as well as sustainability, recycling, and;
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nanocomposites, and renewable and biodegradable materials. It details physical, thermal, and barrier properties as well as sustainability, recycling, and;
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Electronic composites, whose properties can be controlled by thermal or electromagnetic means, play an important role in micro- and nano;
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Electronic composites, whose properties can be controlled by thermal or electromagnetic means, play an important role in micro- and nano;
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Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since;
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Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since;
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This practical book shows how an understanding of structure, thermodynamics, and electrical properties can explain some of the choices;
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cardboard with increased protective properties towards food while keeping their compostability are presented as well. The book also covers natural;
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all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic;
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(dislocations, stacking faults, grain boundaries, and precipitates) are outlined, and their effect on the electronic properties of semiconductors, their;
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(dislocations, stacking faults, grain boundaries, and precipitates) are outlined, and their effect on the electronic properties of semiconductors, their;
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packaging and packaging materials, their properties and technologies Addresses the chemical engineering, physics, and chemistry of packaging;
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Electronic Properties of Materials, 2nd Edition presents the principles of the behavior of electrons in materials and develops a basic understanding;
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Electronic Properties of Materials, 2nd Edition presents the principles of the behavior of electrons in materials and develops a basic understanding;
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provides just that to students and packaging professionals alike: material properties and how they relate to the chemical structure of the polymers;
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provides just that to students and packaging professionals alike: material properties and how they relate to the chemical structure of the polymers;
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national and international efforts to develop these materials, identifies the technical barriers to their development and manufacture, determines;
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. Fundamental concepts are consistently connected to their real-world applications. It covers structural issues, electronic properties, transport;
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