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Materials for High-Density Electronic Packaging and Interconnection is een boek van National Research Council;
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new materials and technologies to increasingly prevalent lead-free manufacturing practices, Electronic Packaging and Interconnection Handbook;
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the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a;
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Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost;
Vergelijkbare producten zoals Electronic Packaging Materials and Their Properties
Testing for High-Temperature Electronic Materials Conclusions and Recommendations References Appendix A: Silicon as a High-Temperature Material;
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reaching their physical limits. Further miniaturization of the electronic components and increase in data storage density are vital for the next;
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This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to RF and Microwave;
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Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global;
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chapters on soft materials-enabled packaging for stretchable and wearable electronics, state of the art miniaturization for active implantable;
Vergelijkbare producten zoals Nano-Bio- Electronic, Photonic and MEMS Packaging
for the calculation of their electronic spectra based on the local density approximation (LDA) breakdown. This is the first attempt to;
Vergelijkbare producten zoals Strong Coulomb Correlations in Electronic Structure Calculations
for the calculation of their electronic spectra based on the local density approximation (LDA) breakdown. This is the first attempt to;
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The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance;
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integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also;
Vergelijkbare producten zoals Power Electronic Packaging
integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also;
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of the emerging trends in electronic packaging to prepare him or her for the near-term miniaturisation and integration of technology trends.;
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Electrochemical Capacitors (ECs) are a class of energy storage device that fill the gap between high energy density batteries and high;
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responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and;
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foundation in mechanical engineering, and access to the latest developments in the electronics field. The emphasis for each project that the;
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Portable consumer electronic devices have experienced exponential growth in recent years. Although the reliability implications and;
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The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century;
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The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century;
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Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants;
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nanoclays and hidrotalcites, cellulose nanofillers and electrospun nanofibers and nanocapsules. Part two investigates high barrier plastics for food;
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Deploying lithium-ion (Li-ion) batteries depends on cost-effective electrode materials with high energy and power density to facilitate;
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vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability;
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The object of this book is to review and to discuss some important applications of polymers in electronics. The first three chapters;
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characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog;
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