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This book provides the basic essentials and fundamentals of electronic packaging technology. It introduces the language and terminology;
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Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to;
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Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost;
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The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance;
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Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since;
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Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since;
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to any online entitlements included with the product. THE MOST COMPREHENSIVE REFERENCE IN ELECTRONIC PACKAGING-COMPLETELY UPDATEDFrom;
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Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are;
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Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment;
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Materials for High-Density Electronic Packaging and Interconnection is een boek van National Research Council;
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sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern;
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sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern;
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In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are;
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Now in its third edition, the Handbook of Package Engineering is still considered the standard indus;...
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Aimed at engineering students, engineers, and technologists of the packaging industry, this book pro;...
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electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS;
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Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and;
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Portable consumer electronic devices have experienced exponential growth in recent years. Although the reliability implications and;
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characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog;
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The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a;
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This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to RF and Microwave;
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Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants;
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This volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognized as;
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an electronic flaschcard program for PCs and Palm Pilots. The CDs contain an adaptive testing feature and Learnkey's Networking Essentials;
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This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging;
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