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Food Packaging: Advanced Materials, Technologies, and Innovations is a one-stop reference for packaging materials researchers working;
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Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new;
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that have occurred over the past decade. It is an invaluable resource for packaging technologists, scientists and engineers, students and;
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The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems;
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The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems;
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transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to;
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in industry, and in regulatory agencies. It is also an excellent book for advanced students studying packaging courses, within pharmacy;
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field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest;
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Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on;
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technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical;
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technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical;
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principles and technologies as well as advanced topics such as active, intelligent, and sustainable packaging with unparalleled depth and breadth;
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Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various;
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address the advantages and challenges of bio-based packaging, discuss new materials to be used for food packaging, and highlight cutting-edge;
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polymers for food packaging provides a comprehensive review of novel polymers and polymer nanocomposites for use in food packaging.
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Nanotechnology for Food Packaging: Materials, Processing Technologies, and Safety Issues showcases the latest research in the use;
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in academic, government and industrial institutions, Advanced Polymeric Materials for Sustainability and Innovations has a special focus on eco;
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Materials for High-Density Electronic Packaging and Interconnection is een boek van National Research Council;
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of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip;
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of bio-based polymers, and legislative demands for food contact packaging materials. Chapters explore opportunities for biopolymers in key end;
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Development of Packaging and Products for Use in Microwave Ovens, Second Edition, supports the efficient design of microwaveable food;
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technologies is an indispensable reference work for all those responsible for the design, production and use of food and beverage packaging, as well as;
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promising strategies for overcoming these limitations. This book provides a host of sustainable packaging solutions that deliver protection;
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This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to;
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functionality for advanced packaging applications;
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in academic, government and industrial institutions, Advanced Polymeric Materials for Sustainability and Innovations has a special focus on eco;
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, machines and processes necessary for a wide range of packaging presentations.It is directed at packaging technologists, those;
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