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Semiconductor Advanced Packaging

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems;

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Semiconductor Advanced Packaging

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems;

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Power Electronic Packaging

covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability;

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Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability;

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Semiconductor Packaging

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust;

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Semiconductor Packaging

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust;

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RF and Microwave Semiconductor Device Handbook

Offering a single volume reference for high frequency semiconductor devices, this handbook covers basic material characteristics, system;

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Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009

Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm;

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Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009

Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm;

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Assembly and Reliability of Lead-Free Solder Joints

in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs;

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Assembly and Reliability of Lead Free Solder Joints

in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs;

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Properties of Advanced Semiconductor Materials

organized in a structured, logical way for each semiconductor material. Reviews traditional semiconductor materials as well as new, advanced;

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Advanced Integrated Communication Microsystems

Learn the fundamentals of integrated communication microsystems Advanced communication microsystems-the latest technology to emerge in the;

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Materials for Advanced Packaging

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new;

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Wafer-Level Chip-Scale Packaging

technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design;

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Microchip Fabrication

any online entitlements included with the product. The most complete, current guide to semiconductor processingFully revised to cover the;

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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics

semiconductor. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and;

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Food Packaging

Food Packaging: Advanced Materials, Technologies, and Innovations is a one-stop reference for packaging materials researchers working;

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Metal Matrix Composites

metal matrix. The markets are: telecommunications, automotive, power semiconductor, opto-electronics, military and aerospace, heavy;

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Essentials of Electronic Packaging

e) typical failures observed are described. A fully tested semiconductor device is the starting point for this text. Thus, no background;

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VLSI Technology

in semiconductor manufacturing, they involve a broad range of technologies. This volume of the Principles and Applications of Engineering series examines;

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Ulsi Semiconductor Technology Atlas

Integration (ULSI) refers to semiconductor chips with more than 10 million devices per chip. Written by three renowned pioneers in their field, ULSI;

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Advanced MEMS Packaging

field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest;

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Semiconductor Glossary

terminology in the area of advanced semiconductor materials, devices, and processes with emphasis on the most current developments across all areas;

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Semiconductor Glossary

terminology in the area of advanced semiconductor materials, devices, and processes with emphasis on the most current developments across all areas;

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Encapsulation Technologies for Electronic Applications

of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development;

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Semiconductor Devices

Semiconductor Devices: Physics and Technology, Third Edition is an introduction to the physical principles of modern semiconductor devices;

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