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Characterization Of Integrated Circuit Packaging Materials

characterization technologies for integrated circuit packaging materials, including acoustic microscopy, atomic absorption spectrometry, Auger Electron;

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Characterization of Optical Materials

summaries of major characterization technologies for integrated circuit packaging materials, including acoustic microscopy, atomic absorption;

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Polymers for Electronic Applications

discuss the current primary applications of polymers in semiconductor device manufacturing: polymers as resist materials for integrated circuit;

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Advanced Polyimide Materials

photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs;

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Materials Science of Microelectromechanical Systems (MEMS) Devices II

consideration, because it is often application specific. This book investigates various materials, characterization methods and processing techniques;

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Electronic Packaging Science and Technology

the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a;

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Electronic Packaging Materials and Their Properties

protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging;

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Semiconductor Packaging

, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as;

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Semiconductor Packaging

, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as;

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Systems-Level Packaging for Millimeter-Wave Transceivers

forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between;

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Food Packaging

Design -Packaging Production and Characterization -Interaction between Packaging and Food -Regulatory Aspects It;

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Food Packaging

Production and Characterization -Interaction between Packaging and Food -Regulatory Aspects It is an ideal reference source for;

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Power Electronic Packaging

integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also;

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Failure-Free Integrated Circuit Packages

in Failure- Free Integrated Circuit Packages gives you a visual reference on common failure modes of IC devices in organic packages. In addition;

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Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also;

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Passive RF Integrated Circuits

This book, written by recognized experts in the field, is intended for designers of RF or microwave passive integrated circuits. It;

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Bio-Based Packaging - Material, Environmental and Economic Aspects

packaging development, characterization, regulations and environmental and socio-economic impact Contains real-world case studies of bio-based;

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Microchip Fabrication

evaluation The business of wafer fabrication Devices and integrated circuit formation Integrated circuits Packaging;

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Starch-Based Materials in Food Packaging

Starch-Based Materials in Food Packaging: Processing, Characterization and Applications comprises an experimental approach related to;

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3D and Circuit Integration of MEMS

3D and Circuit Integration of MEMS Explore heterogeneous circuit integration and the packaging needed for practical applications;

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TMS 2008 137th Annual Meeting and Exhibition

This volume contains a collection of papers from 10 symposia, related to materials characterization, computation and modeling, held at the;

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Ecosustainable Polymer Nanomaterials for Food Packaging

, Characterization Needs, Safety and Environmental Issues examines the complete life cycle of packaging based on polymer nanomaterials. Focusing on;

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Ecosustainable Polymer Nanomaterials for Food Packaging

, Characterization Needs, Safety and Environmental Issues examines the complete life cycle of packaging based on polymer nanomaterials. Focusing on;

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Microelectromechanical Systems

specific set of objectives. The silicon-based integrated circuits process is so highly refined it can produce millions of electrical elements on a;

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Commercial Wireless Circuits and Components Handbook

signal characterization, and high volume testing techniques for both devices and circuits. This handbook not only provides important information;

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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic;

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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic;

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