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Data Integrity for On-Chip Interconnects

The desire for having a smaller-faster chip that does more than ever before, has led to shrinking feature size and growing integration;

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Self-Organized 3D Integrated Optical Interconnects

Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super;

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Photonic Interconnects for Computing Systems

, performance analysis, evaluation and prediction of silicon photonic interconnects for inter- and intra-chip communication, paving the way for the;

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Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile;

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Power Integrity for Nanoscale Integrated Systems

and substrate noise impact on circuits Clock generation and distribution with power integrity Signal and power integrity design for I/O;

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Handbook of Optical Interconnects

networks closer to access points, optical interconnects promise to provide efficient, high-speed data transmission for the next generation;

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Handbook of Optical Interconnects

networks closer to access points, optical interconnects promise to provide efficient, high-speed data transmission for the next generation;

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Low Power Interconnect Design

This book provides practical solutions for delay and power reduction for on-chip interconnects and buses. It provides an in depth;

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High-Speed Photonics Interconnects

Dramatic increases in processing power have rapidly scaled on-chip aggregate bandwidths into the Tb/s range. This necessitates a;

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Carbon Nanotube and Graphene Nanoribbon Interconnects

An Alternative to Copper-Based Interconnect Technology With an increase in demand for more circuit components on a single chip, there;

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Carbon Nanotube and Graphene Nanoribbon Interconnects

An Alternative to Copper-Based Interconnect Technology With an increase in demand for more circuit components on a single chip, there;

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On-Chip Photonic Interconnects

As the number of cores on a chip continues to climb, architects will need to address both bandwidth and power consumption issues related to;

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On-Chip Photonic Interconnects

As the number of cores on a chip continues to climb, architects will need to address both bandwidth and power consumption issues related to;

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Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009

for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges;

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Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009

for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges;

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Advanced Interconnects for ULSI Technology

Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k;

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Optical Interconnects for Data Centers

Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to;

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Optical Interconnects for Future Data Center Networks

efficient interconnects for future data centers with increased communication bandwidth requirements. This contributed volume presents an integrated;

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High Frequency Interconnect Characterization and Modeling

of IC packages impose limits on the circuit performance at RF frequencies. This book presents modeling of on-chip inductance for chips with;

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Analytical Methodology of Tree Microstrip Interconnects Modelling For Signal Distribution

(SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based;

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Analytical Methodology of Tree Microstrip Interconnects Modelling For Signal Dis

(SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based;

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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics

packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as;

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High Performance Integrated Circuit Design

role of on-chip interconnects and provides an overview of technology scaling. The book goes on to cover data signaling, power management;

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Fundamentals of Power Integrity for Computer Platforms and Systems

of Power Integrity for Computer Platforms and Systems is an ideal introductory text for engineers of power integrity as well as those in the chip;

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Network-on-Chip

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip;

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Noise Coupling in System-on-Chip

Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate;

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Design and Crosstalk Analysis in Carbon Nanotube Interconnects

This book provides a single-source reference on carbon nanotubes for interconnect applications. It presents the recent advances;

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