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Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile;

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Power Integrity for Nanoscale Integrated Systems

and substrate noise impact on circuits Clock generation and distribution with power integrity Signal and power integrity design for I/O;

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High Performance Integrated Circuit Design

role of on-chip interconnects and provides an overview of technology scaling. The book goes on to cover data signaling, power management;

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Noise Coupling in System-on-Chip

noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters;

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Signal Integrity Effects in Custom IC and ASIC Designs

modeling real-world IC signal integrity issues for CAD and IC design engineers, as well as graduate engineering students. Practical, in-depth;

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Noise Contamination in Nanoscale VLSI Circuits

This textbook provides readers with a comprehensive introduction to various noise sources that significantly reduce performance and;

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Optimal Interconnect Networks for 2D and 3D Microchips

," with performance limited by signal, power, clock and thermal interconnect networks. Techniques to tackle this interconnect challenge are;

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Analytical Methodology of Tree Microstrip Interconnects Modelling For Signal Distribution

(SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based;

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Analytical Methodology of Tree Microstrip Interconnects Modelling For Signal Dis

(SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based;

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Advanced Signal Integrity for High-Speed Digital Designs

understanding of the emerging high-speed signal integrity issues that are creating roadblocks in digital design. Written by the foremost experts on the;

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Low Power Interconnect Design

This book provides practical solutions for delay and power reduction for on-chip interconnects and buses. It provides an in depth;

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Silicon-on-Sapphire Circuits and Systems

photosensitive circuits and memory chips, deploying integrated biosensors, overcoming noise and power issues, and maximizing efficiency. Discover how to;

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Carbon Nanotube and Graphene Nanoribbon Interconnects

and frequency response of the CNT and GNR interconnects Explores the signal integrity analysis for CNT and GNR interconnects Models and;

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Carbon Nanotube and Graphene Nanoribbon Interconnects

and frequency response of the CNT and GNR interconnects Explores the signal integrity analysis for CNT and GNR interconnects Models and;

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Broadband Direct RF Digitization Receivers

This book discusses the trade-offs involved in designing direct RF digitization receivers for the radio frequency and digital signal;

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Sensors, Systems and Instrumentation

series Advanced Issues on Signals, Systems and Devices presents original publications mainly from speakers on the International Conferences on;

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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address;

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Experimental Micro/Nanoscale Thermal Transport

This book covers the new technologies on micro/nanoscale thermal characterization developed in the Micro/Nanoscale Thermal Science;

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Fundamentals of Power Integrity for Computer Platforms and Systems

An all-encompassing text that focuses on the fundamentals of power integrity Power integrity is the study of power distribution from the;

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Signal Recovery from Noise in Electronic Instrumentation

background sources and systematic signal drift or offset. In the case of random noise, the book fully analyzes 1/f as well as white noise. It also;

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Signal Recovery from Noise in Electronic Instrumentation

background sources and systematic signal drift or offset. In the case of random noise, the book fully analyzes 1/f as well as white noise. It also;

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Design Of High-speed Communication Circuits

. Furthermore, this reduction in feature size also has a significant impact on mixed-signal circuits. Due to the higher levels of integration, the;

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Noises in Optical Communications and Photonic Systems

Transmitting information over optical fibers requires a high degree of signal integrity due to noise levels existing in optical systems;

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Noises in Optical Communications and Photonic Systems

Transmitting information over optical fibers requires a high degree of signal integrity due to noise levels existing in optical systems;

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Analysis of Signal Integrity and Power Integrity at System Level

is increasing in an exponential manner, Signal Integrity (SI) effects and Power Integrity (PI) effects, resulting in (BER) take place at a considerable;

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On-Chip Photonic Interconnects

As the number of cores on a chip continues to climb, architects will need to address both bandwidth and power consumption issues related to;

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On-Chip Photonic Interconnects

As the number of cores on a chip continues to climb, architects will need to address both bandwidth and power consumption issues related to;

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