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3D IC Stacking Technology
focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods;
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3D Integration in VLSI Circuits
from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and;
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3D Integration in VLSI Circuits: Implementation Technologies and Applications
from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D;
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3D IC Integration and Packaging
to any online entitlements included with the product. A comprehensive guide to 3D IC integration and packaging technology 3D;
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Die-stacking Architecture
solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip;
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3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability;
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3D Integration for VLSI Systems
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the;
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Vertical 3D Memory Technologies
cross-point arrays, and 2.5D3D stacking of memory and processor chips with through-silicon-via connections now and remote links later. Key;
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Electromigration Modeling at Circuit Layout Level
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly;
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Design of 3D Integrated Circuits and Systems
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology;
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Design of 3D Integrated Circuits and Systems
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology;
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More-than-Moore 2.5D and 3D SiP Integration
implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore's Law track;
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More-than-Moore 2.5D and 3D SiP Integration
implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore's Law track;
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1D and Multi-D Modeling Techniques for IC Engine Simulation
models and coupled 1D-3D modeling techniques, including 0D combustion models, quasi-3D methods, and some 3D model applications.;
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Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology
Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to;
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Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology
Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to;
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Investigation on SiGe Selective Epitaxy for Source and Drain Engineering in 22 n
This thesis presents the SiGe source and drain (S/D) technology in the context of advanced CMOS, and addresses both device processing and;
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Advances in IC Engines and Combustion Technology
This book comprises select peer-reviewed proceedings of the 26th National Conference on IC Engines and Combustion (NCICEC) 2019 which;
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IC-BCT 2019
This book presents articles from the International Conference on Blockchain Technology (IC-BCT) 2019, held in Mumbai, India, and highlights;
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IC BCT 2019
This book presents articles from the International Conference on Blockchain Technology (IC-BCT) 2019, held in Mumbai, India, and highlights;
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Government Venture Capital
shortfalls. This thesis explores two aspects of the In-Q-Tel model, whether In-Q-Tel creates relationships between the IC and promising technology;
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IC Component Sockets
A broad and practical reference to IC socket technology The first and only comprehensive resource on IC (Integrated Circuit) socket;
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Microelectronic Applications of Chemical Mechanical Planarization
technologies, including topics like CMP with nanomaterials and 3D chips Discusses different types of CMP tools, pads for IC CMP, modeling, and the;
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