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, professional and student the critical areas of development for 3D vertical memory chips including: gate-all-around and junction-less nanowire memories;
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perspectives * Describes new program disturb issues, data retention, power consumption, and possible solutions for the challenges of 3D NAND flash;
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element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the;
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development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth;
Vergelijkbare producten zoals Design of 3D Integrated Circuits and Systems
development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth;
Vergelijkbare producten zoals Design of 3D Integrated Circuits and Systems
element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the;
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printing technologies; naked, dynamic and auxiliary 3D displays; VR/AR/MR devices; VR camera technologies; microprocessors for 3D data processing;
Vergelijkbare producten zoals Advances in 3D Image and Graphics Representation Analysis Computing and Inform
printing technologies; naked, dynamic and auxiliary 3D displays; VR/AR/MR devices; VR camera technologies; microprocessors for 3D data processing;
Vergelijkbare producten zoals Advances in 3D Image and Graphics Representation, Analysis, Computing and Information Technology
ferroelectric memories, MRAM technologies, and 3D memory. Finally, to further widen the discussion on the applications space, neuromorphic computing;
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solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip;
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. In order to fulfil the expectation of enhanced user experience, 3D video calls for new technologies addressing efficient content creation;
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This edited volume comprises select chapters on advanced technologies for 3D printing and additive manufacturing and how these technologies;
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: materials, technologies, and applications, is a comprehensive review of functional 3D scaffolds, providing information on the fundamentals;
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Provides coverage of the major theories and technologies involved in the lifecycle of 3D video content delivery Presenting the technologies;
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the current state-of-the-art technologies available for 3D cell culture * Features contributions from leading developers and researchers;
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controllers, etc. All these technologies which let a user interact in three dimensions are called 3D user interface technologies. These 3D user;
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Provides a comprehensive review and evaluation of waste containment technologies presently practiced in remediation applications. Covers;
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heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture;
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some emerging technologies have been proposed as alternatives to flash memory in the nano-regime. Nonvolatile Memory Design: Magnetic;
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some emerging technologies have been proposed as alternatives to flash memory in the nano-regime. Nonvolatile Memory Design: Magnetic;
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contributions of the model are: enhancing data input and user efficiency through a 3D graphic interface and automated horizontal and vertical curve;
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; data Integration; disaster tolerance and recovery; artificial Intelligence; emerging storage technologies (NVMe, 3D XPoint Memory etc.); hybrid;
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This book explores the design implications of emerging, non-volatile memory (NVM) technologies on future computer memory hierarchy;
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disciplines interested in understanding the various 3D technologies. A timely guide is provided to the present status of development in 3D display;
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to any online entitlements included with the product. A comprehensive guide to 3D IC integration and packaging technology 3D;
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3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D;
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3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D;
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