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3D IC Integration and Packaging
to any online entitlements included with the product. A comprehensive guide to 3D IC integration and packaging technology 3D;
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3D Integration for VLSI Systems
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the;
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3D IC Stacking Technology
focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods;
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1D and Multi-D Modeling Techniques for IC Engine Simulation
models and coupled 1D-3D modeling techniques, including 0D combustion models, quasi-3D methods, and some 3D model applications.;
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Electromigration Modeling at Circuit Layout Level
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly;
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3D Integration in VLSI Circuits
monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design;
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3D Integration in VLSI Circuits: Implementation Technologies and Applications
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer;
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3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability;
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Split Manufacturing of Integrated Circuits for Hardware Security and Trust
Globalization of the integrated circuit (IC) supply chains led to many potential vulnerabilities. Several attack scenarios can exploit;
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Split Manufacturing of Integrated Circuits for Hardware Security and Trust
Globalization of the integrated circuit (IC) supply chains led to many potential vulnerabilities. Several attack scenarios can exploit;
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Emerging Devices for Low-Power and High-Performance Nanosystems
integration in 2D, above IC, and in 3D. This book reviews the capabilities of integrated nanosystems to match low power and high performance;
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Integrated Care
This book provides pertinent and practical information about how to create, work, and thrive in an Integrated Care (IC) setting. Unlike;
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Application of IC-MS and IC-ICP-MS in Environmental Research
Introduces the reader to the field of ion chromatography, species analysis and hyphenated methods IC-MS and IC-ICP-MS including the theory;
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Ic ga daer ic hebbe te doene
Ic Ga Daer Ic Hebbe te Doene: Opstellen aangeboden aan prof. dr. F. Lulofs ter gelegenheid van zijn afscheid als hoogleraar;
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More-than-Moore 2.5D and 3D SiP Integration
regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well;
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More-than-Moore 2.5D and 3D SiP Integration
regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well;
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Applications of Ion Chromatography in the Analysis of Pharmaceutical and Biological Products
This is a comprehensive source of information on the application of ion chromatography (IC) in the analysis of pharmaceutical drugs and;
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Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology
Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to;
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Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology
Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to;
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Intellectual Capital and Organizational Performance
This monograph provides empirical evidence on the relationship between intellectual capital (IC) and organizational performance of social;
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Intellectual Capital and Organizational Performance
This monograph provides empirical evidence on the relationship between intellectual capital (IC) and organizational performance of social;
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Advanced MEMS Packaging
any online entitlements included with the product. A comprehensive guide to 3D MEMS packaging methods and solutionsWritten by experts in the;
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Klinische ethiek op de IC
werkzaam op een IC weet dat er bij dit handelen zeer regelmatig ethische en juridische vragen rijzen. Hoe zit het met beroepsgeheim op de IC;
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Einde inhoud
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