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Microelectronic Applications of Chemical Mechanical Planarization

detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: Provides;

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Tribology In Chemical-Mechanical Planarization

of Chemical-Mechanical planarization (CMP) technology, particularly when applied to nanosurfaces. Tribology in Chemical-Mechanical Planarization;

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Chemical-Mechanical Planarization of Semiconductor Materials

This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the;

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Microelectronic Packaging

book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry;

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Nanostructured Materials and Nanotechnology

chemical mechanical planarization, display, health and cosmetic applications; nanotubes and nanowires, nanolithography, and industrial development;

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Nanostructured Materials and Nanotechnology II

mechanical planarization, display, health, and cosmetic applications; nanotubes and nanowires; and industrial development.;

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Advances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that;

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Chemical-Mechanical Polishing 2000

Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench;

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Nanoparticle Engineering for Chemical-Mechanical Planarization

achieving higher performance devices. Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties;

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Nanoparticle Engineering for Chemical-Mechanical Planarization

achieving higher performance devices. Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties;

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Advances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high;

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Science and Technology of Chemical Mechanical Planarization (Cmp)

of high-performance diamond research. Chemical, electrochemical, and biochemical sensing, including nanodiamond for sensing in-cellular;

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Structural Analysis in Microelectronic and Fiber-Optic Systems

deals with mechanical behavior of microelectronic and fiber-optic systems and is written in response to the crucial need for a textbook for a;

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Chemical-Mechanical Polishing Fundamentals and Challenges

Chemical-mechanical planarization (CMP) has emerged over the past few years as a key enabling technology in the relentless drive of the;

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Thermo-Hydromechanical and Chemical Coupling in Geomaterials and Applications

GeoProc2008 collects the proceedings of the International Conference on Coupled T-H-M-C (thermal, hydraulic, mechanical, chemical;

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Chemical Perspectives of Microelectronic Materials

The MRS Symposium Proceeding series is an internationally recognised reference suitable for research;...

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Graphene Science Handbook

Properties Volume Four: Mechanical and Chemical Properties Volume Five: Size-Dependent Properties Volume Six: Applications and;

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Nanostructured Materials

mechanical applications, nanoelectronics and microelectronic devices, nano-optics, nanophotonics and nano-optoelectronics, as well as piezoelectric;

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Nanostructured Materials

mechanical applications, nanoelectronics and microelectronic devices, nano-optics, nanophotonics and nano-optoelectronics, as well as piezoelectric;

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Biosensors

active in the field of chemical sensors, analytical chemistry, or microelectronics will find this an invaluable reference.;

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Biosensors

active in the field of chemical sensors, analytical chemistry, or microelectronics will find this an invaluable reference.;

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Organic Mechanochemistry and Its Practical Applications

book considers transformations of organic substances upon mechanical actions and explains how mechanical energy is transformed into chemical;

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Joining Processes

introductory overviews are given of firstly, the mechanical, chemical and physical phenomena related to surfaces, contacts and joins. In subsequent;

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Fluid Mechanics for Chemical Engineering

turbulence and its application for stirring, mixing and chemical reaction. The third part addresses mechanical separation processes by considering;

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Mechanical and Corrosion-Resistant Properties of Plastics and Elastomers

A study of the physical, mechanical and corrosion resistant properties of all the most common commercially available plastics and;

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Mechanical and Corrosion-Resistant Properties of Plastics and Elastomers

A study of the physical, mechanical and corrosion resistant properties of all the most common commercially available plastics and;

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Nanocomposites for the Desulfurization of Fuels

for enhancing surface-to-volume ratio, reactivity, strength, and durability. Due to their enhanced chemical and mechanical properties, the;

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