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This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the;
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of Chemical-Mechanical planarization (CMP) technology, particularly when applied to nanosurfaces. Tribology in Chemical-Mechanical Planarization;
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Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high;
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Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that;
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An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the;
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Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench;
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chemical mechanical planarization, display, health and cosmetic applications; nanotubes and nanowires, nanolithography, and industrial development;
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mechanical planarization, display, health, and cosmetic applications; nanotubes and nanowires; and industrial development.;
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Photolithography Materials Wet and Dry Etching Materials Chemical Mechanical Planarizing Methods Carrier Gases Uncategorized Materials Semiconductor;
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Chemical-mechanical planarization (CMP) has emerged over the past few years as a key enabling technology in the relentless drive of the;
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become the 'ultimate semiconductor' in the early 1990s, diamond initially failed to match the impressive developments made with other wide;
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achieving higher performance devices. Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties;
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achieving higher performance devices. Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties;
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Semiconductor Materials presents physico-chemical, electronic, electrical, elastic, mechanical, magnetic, optical, and other properties;
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Cluster Materials is the fourth volume of the highly successful series Advances in Metal and Semiconductor Clusters. In this volume the;
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) semiconductor physics and materials, including topics in deep level defects and band structures, (2) CMOS devices, including the topics in device;
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amorphous semiconductors; computational semiconductor physics; interface properties, including the physics and chemistry of heterojunctions, metal;
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amorphous semiconductors; computational semiconductor physics; interface properties, including the physics and chemistry of heterojunctions, metal;
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amorphous semiconductors; computational semiconductor physics; interface properties, including the physics and chemistry of heterojunctions, metal;
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amorphous semiconductors; computational semiconductor physics; interface properties, including the physics and chemistry of heterojunctions, metal;
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amorphous semiconductors; computational semiconductor physics; interface properties, including the physics and chemistry of heterojunctions, metal;
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amorphous semiconductors; computational semiconductor physics; interface properties, including the physics and chemistry of heterojunctions, metal;
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Molecular crystals Polymers Glasses Hot hardness Chemical hardness Super-hard materials Chemistry and Physics of Mechanical Hardness;
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, chemical, mechanical, corrosion, industrial, civil, and maintenance engineering; and surface chemistry.;
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, chemical, mechanical, corrosion, industrial, civil, and maintenance engineering; and surface chemistry.;
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The scientific basis of the technique of semiconductor chemical sensors is the main focus of this work. The book concentrates on the usage;
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amorphous semiconductors; computational semiconductor physics; interface properties, including the physics and chemistry of heterojunctions, metal;
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