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Silicon Analog Components: Device Design, Process Integration, Characterization, and Reliability

design, component characteristics, and reliability; Describes in step-by-step fashion the components that are used in analog designs, the;

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Silicon Analog Components

design, component characteristics, and reliability; Describes in step-by-step fashion the components that are used in analog designs, the;

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Wafer-Level Chip-Scale Packaging

characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog;

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Silicon Germanium

of IBM's SiGe technologies Highlight details of highly integrated SiGe BiCMOS system-on-chip (SOC) design Written for RFanalog and mixed-signal;

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Silicon Based Unified Memory Devices and Technology

The primary focus of this book is on basic device concepts, memory cell design, and process technology integration. The first part provides;

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Silicon Based Unified Memory Devices and Technology

The primary focus of this book is on basic device concepts, memory cell design, and process technology integration. The first part provides;

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Resistive Random Access Memory (RRAM)

. State-of-the-art RRAM device performances, characterization, and modeling techniques are summarized, and the design considerations of the RRAM;

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Resistive Random Access Memory (RRAM)

. State-of-the-art RRAM device performances, characterization, and modeling techniques are summarized, and the design considerations of the RRAM;

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Current Trends In Heterojunction Bipolar Transistors

device advantages. This book reviews the present status of GaAs, InP and silicon-based HBT technologies and their applications to digital, analog;

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Mixed-Signal Systems

A practical guide to the successful integration of digital and analog circuits Mixed-signal processing the integration of digital and;

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Semiconductor Process Reliability in Practice

field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for;

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ULSI Devices

miniaturization and simulation Issues of reliability and the hot carrier effect Digital and analog circuit building blocks;

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Design Of High-speed Communication Circuits

MOS technology has rapidly become the de facto standard for mixed-signal integrated circuit design due to the high levels of integration;

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CMOS Analog Integrated Circuits

design, which merges analog circuits with digital, and radio-frequency components. CMOS: Analog Integrated Circuits: High-Speed and Power;

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CMOS Analog Integrated Circuits

design, which merges analog circuits with digital, and radio-frequency components. CMOS: Analog Integrated Circuits: High-Speed and Power;

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System Integration

a chip design and integration. It combines coverage of semiconductor physics, digital VLSI design and analog integrated circuits in one;

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CMOS RF Circuit Design for Reliability and Variability

The subject of this book is CMOS RF circuit design for reliability. The device reliability and process variation issues on RF transmitter;

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CMOS Analog Integrated Circuits

design, which merges analog circuits with digital, and radio-frequency components.;

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CMOS Analog Integrated Circuits

design, which merges analog circuits with digital, and radio-frequency components.;

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Guidebook for Managing Silicon Chip Reliability

, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms;

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Guidebook for Managing Silicon Chip Reliability

, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms;

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3D IC Stacking Technology

focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods;

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MEMS Reliability

development and characterization, material property characterization, failure mechanisms and physics of failure (POF), design strategies for improving;

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On-Wafer Calibration Techniques Enabling Accurate Characterization of High-Performance Silicon Devices at the mm-Wave Range and Beyond

wave frequencies plays a crucial role in the modern IC design debug. Most importantly, however, is the step of device characterization for;

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Device Modeling For Analog And Rf Cmos Circuit Design

* Bridges the gap between device modelling and analog circuit design.* Includes dedicated software enabling actual circuit design.* Covers;

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Organic Solar Cells

electrical and optical testing and modeling, as well as layer morphology control and characterization. The integration of the different components;

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Short-Channel Organic Thin-Film Transistors

. Over the past few years, OTFTs have undergone remarkable advances in terms of reliability, performance and scale of integration. Many factors;

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