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Handbook of 3D Integration, Volume 4
This fourth volume of the landmark handbook focuses on the design, testing and thermal management of 3D-integrated devices, both from a;
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Handbook Of 3D Integration
aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor;
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3D Integration in VLSI Circuits
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer;
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3D Integration in VLSI Circuits: Implementation Technologies and Applications
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer;
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Handbook of 3D Integration
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book;
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3D IC Integration and Packaging
to any online entitlements included with the product. A comprehensive guide to 3D IC integration and packaging technology 3D;
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Design of 3D Integrated Circuits and Systems
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology;
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Design of 3D Integrated Circuits and Systems
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology;
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EU Investment and Banking System Handbook Volume 1 Integration, Financial, Investment Policy, Regulations
EU Investment and Banking System Handbook Volume 1 Integration, Financial, Investment Policy, Regulations;
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Handbook Of Metalloproteins
more than two hundred known 3D structures of zinc enzymes, the handbook focuses on contributions for those enzymes most relevant in research;
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The Handbook of Mathematics Teacher Education: Volume 4
ISBN The Handbook of Mathematics Teacher Education: Volume 4. Type boekomslag: Paperback, Uitgever: Brill, Sense, Minimum bestelhoeveelheid;
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Handbook of Industrial Organization: Volume 4
Handbook of Industrial Organization, Volume Four highlights new advances in the field, with this new;...
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Advances In 3d Integrated Circuits And Systems
3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D;
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Advances In 3d Integrated Circuits And Systems
3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D;
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Handbook of Industrial Organization: Volume 5
Handbook of Industrial Organization Volume 4 highlights new advances in the field, with this new volume presenting interesting chapters;
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Electronic Design Automation for Integrated Circuits Handbook, Second Edition - Two Volume Set
system-level models, 3D circuit integration, and clock design Offering improved depth and modernity, Electronic Design Automation for;
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Handbook of 3D Machine Vision: Optical Metrology and Imaging
With the ongoing release of 3D movies and the emergence of 3D TVs, 3D imaging technologies have penetrated our daily lives. Yet choosing;
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Handbook of 3D Machine Vision: Optical Metrology and Imaging
With the ongoing release of 3D movies and the emergence of 3D TVs, 3D imaging technologies have penetrated our daily lives. Yet choosing;
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Handbook of Optomechanical Engineering
This comprehensive handbook covers all major aspects of optomechanical engineering - from conceptual design to fabrication and integration;
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Modeling and Simulation of Logistics Flows 3
simulation; - Flows in 3D for conveying and storage The conclusion discusses the future developments of the software and their integration into;
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The Handbook of Mathematics Teacher Education
ISBN The Handbook of Mathematics Teacher Education: Volume 4. Type boekomslag: Hardcover, Uitgever: Brill, Sense, Minimum bestelhoeveelheid;
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3D Interconnect Architectures for Heterogeneous Technologies
heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture;
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Die-stacking Architecture
-multiprocessor design, mitigating the memory wall problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative;
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