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Dielectric Films for Advanced Microelectronics

of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It;

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Surfaces, Interfaces, and Films for Microelectronics

explains key concepts and important analytical techniques. It discusses films and interfaces, electronic passivation of semiconductor-dielectric;

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Handbook of Advanced Semiconductor Technology and Computer Systems

widely accepted in microelectronics for the deposition of amorphous dielectric films such as silicon nitride and silicon oxide. The main;

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Advances in Dielectric Materials and Electronic Devices

Advanced Dielectrics for Wireless Communications symposia. Topics include design of material, materials synthesis and processing, processing;

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Advanced Dielectric, Piezoelectric and Ferroelectric Thin Films

Advances in synthesis and characterization of dielectric, piezoelectric and ferroelectric thin films are included in this volume;

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Adhesion in Microelectronics

of molding compounds * Adhesion of different dielectric materials * Delamination and reliability issues in packaged devices * Interface mechanics and;

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Ceramic Materials and Multilayer Electronic Devices

This volume contains a collection of 40 papers from two symposia: Advanced Dielectric Materials and Multilayer Electronic Devices and High;

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Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics

This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the;

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Dielectric Spectroscopy of Electronic Materials

and applications of dielectric spectroscopy for solids, mostly for the investigation of materials used in electronics. The book differs from;

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Advanced Polyimide Materials

Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on;

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Electronic Material Science And Surfaces, Interfaces, And Thin Films For Microelectronics

, Interfaces, and Films for Microelectronics and Electronic Materials Science by Eugene Irene introduces the reader to the field of materials science;

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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics

(Cu) interconnects and dielectric materials with a low-dielectric constant (k) of about 3.0. However, for the next generations of 65nm node;

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Polyimides and Other High Temperature Polymers

films; polyimide modified with fullerenes; semicrystalline polyimides for advanced composites; and wear performance of polyetherimide composite.;

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Third Generation Photovoltaics

of high performance thin-films. The book explores, self-consistently, the energy conversion potential of advanced approaches for improving;

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Third Generation Photovoltaics

of high performance thin-films. The book explores, self-consistently, the energy conversion potential of advanced approaches for improving;

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Polyimides and Other High Temperature Polymers

on polyimide films; polyimide modified with fullerenes; semicrystalline polyimides for advanced composites; and wear performance;

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Handbook of Advanced Dielectric, Piezoelectric and Ferroelectric Materials

This comprehensive book covers recent developments in advanced dielectric, piezoelectric and ferroelectric materials. It presents recent;

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Materials Science in Microelectronics II

The subject matter of thin-films ? which play a key role in microelectronics ? divides naturally int;...

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Chemical Processing of Dielectrics, Insulators and Electronic Ceramics

dielectric gate oxides, ferroelectric oxide films for infrared and memory applications, low-k dielectrics, TiN and TaN diffusion barriers, and fresh;

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Polymer Nanocomposites for Dielectrics

recent progress in new dielectric polymer nanocomposites based on biomaterials and hybrid nanomaterial systems for advanced dielectric;

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Surface Physics

calculation of surface and adhesion characteristics for a wide range of materials: metals, alloys, semiconductors, and complex compounds. The authors;

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Surface Physics

calculation of surface and adhesion characteristics for a wide range of materials: metals, alloys, semiconductors, and complex compounds. The authors;

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Advances in Microelectronics & Photonics

developments in the semiconductor devices for future generation microelectronics and photonics technologies. It includes some advanced CMOS device;

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Advances in Antenna, Signal Processing, and Microelectronics Engineering

With the rapid growth of wireless communications, this book meets the strong demand for information and new research in the area of antenna;

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High-k Gate Dielectric Materials

semiconductor industry and the International Technology Roadmap for Semiconductors (ITRS). The application of high-k gate dielectric materials is a;

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MRS Proceedings Advanced Metallizations in Microelectronics

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.;

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