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Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as;
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Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as;
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This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It;
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Vergelijkbare producten zoals El Exilio de la Verdad
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gesammelt werden. Die vorliegende Arbeit konzentriert sich dabei auf das Annealingverhalten von Through-Silicon-Via-Strukturen (TSVs). Im Fokus;
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Through extensive interviews with Dutch entrepreneurs working in the area, Maas and Ester show that Silicon Valley is above all a mind-set;
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Given silicon's versatile material properties, use of low-cost silicon photonics continues to move beyond light-speed data transmission;
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Given silicon's versatile material properties, use of low-cost silicon photonics continues to move beyond light-speed data transmission;
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This book provides a comprehensive overview of the state of art of lasers on silicon for photonic integration. The authors demonstrate the;
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issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed;
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Polycrystalline silicon (commonly called polysilicon ) is the material of choice for photovoltaic (PV) applications. Polysilicon is the;
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porous silicon. Drawing upon a vast amount of recently published literature, the book guides readers through practical implementations;
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communications systems. One of the prime candidates to provide satisfactory performance at low cost in the photonic circuit is silicon. Whilst silicon;
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In Maximum Impact, the author takes readers on an exciting journey, with its cast of exceptional founders, through the early days;
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from materials through processes to devices and applications it encapsulates the entire silicon germanium business of today and assesses future;
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One of the first books to cover advanced silicon-based technologies, Advanced Silicon and Semiconducting Silicon Alloy-Based Materials and;
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One of the first books to cover advanced silicon-based technologies, Advanced Silicon and Semiconducting Silicon Alloy-Based Materials and;
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porous silicon. Drawing upon a vast amount of recently published literature, the book guides readers through practical implementations;
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From design and simulation through to testing and fabrication, this hands-on introduction to silicon photonics engineering equips students;
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IC Integration and Packaging covers: * 3D integration for semiconductor IC packaging * Through-silicon vias modeling and testing;
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through such texturing of the front surface of mono-silicon solar cells. A proper optimisation of texture angle appears to be important for the;
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Eight contributions address: GaAs on Si, ion beam synthesis in silicon, ion beam processing of chemical vapor deposited silicon layers;
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Silicon, as a single-crystal semiconductor, has sparked a revolution in the field of electronics and touched nearly every field of science;
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Silicon, as a single-crystal semiconductor, has sparked a revolution in the field of electronics and touched nearly every field of science;
Vergelijkbare producten zoals Crystal Growth and Evaluation of Silicon for VLSI and ULSI
The book starts with an introduction on silicon isotopes and related analytical methods, and explains the mechanisms of silicon isotope;
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